Mitsubishi Chemical has developed a new material for semiconductor packaging. The company states that this material possesses the unique characteristic of "shrinking when heated."
Mitsubishi Chemical Develops New Material That Shrinks When Heated for Semiconductor Packaging
This article is a translation. Read the Japanese original
This development aims to address the "thermal issues" of semiconductors in the AI era. The company explained that this material will be useful in solving these challenges.
Source: 三菱ケミカル、半導体向けに「温めると縮む新材料」開発 AI時代の課題に光明、何がすごいのか? (ITmedia AI+, 2026-09-01)