Samsung Electronics is expected to more than double its output of the HBM4 family of high-bandwidth memory chips next year, according to semiconductor industry sources on September 20. This production ramp includes sixth-generation HBM4 and seventh-generation HBM4E products.
Samsung to more than double HBM4 production next year as glass carrier demand surges
The expected increase is linked to a planned 2.5-fold rise in demand for glass carriers. These are glass supports temporarily attached to the underside of HBM DRAM wafers to prevent bending or cracking during thinning and drilling processes. Samsung plans to increase its outsourced cleaning volume for these carriers to 50,000 sheets per month next year, up from 20,000 sheets per month this year.
Industry analysts suggest that even when accounting for the reuse of cleaned carriers and varying yields, a 2.5-fold increase in material volume makes it highly likely that HBM4 and HBM4E output will grow at least twofold from this year.
Samsung's HBM production scale is expected to grow nearly 40% next year, reaching approximately 250,000 wafers per month on average, up from roughly 180,000 wafers this year. In terms of product mix, the HBM4 family is projected to rise from about 40% this year to approximately 80% next year as HBM4E mass production ramps up.
Sources
- Samsung is expected to more than double output of its HBM4 and HBM4E DRAM （Hacker News Frontpage, 2026-09-20）
- Seoul Economic Daily